Mxene Modified Conductive Flexible Printed Circuit

Description

Description This product is Mxene modified conductive flexible printed circuit.
Please Stir thoroughly for 5 to 10 minutes before use. Please use special thinner for dilution, and the addition ratio should not exceed 3% of the total weight.

Features And Benefits

Features And Benefits High conductivity and good adhesion
Good printability, electrical conductivity, high hardness and strong adhesion.
Good bending resistance, low modulus, good performance and excellent solvent resistance.
Good adhesion to PET, PI, ITO substrate and FR substrate.

Application

Application Printing of electronic circuits such as membrane switches, keyboards, remote controls, flexible printed circuits and FPCs.

Specifications

Purity	0.99
Appearance	liquid
Characterization Methods	TEM, XPS, SIMS, Raman, and XRD
Composition	Nb2C, Ti2C, V2C, Ti3C2
Packaging	50 ml
Recommended Process	Printing thickness: wet film: 20μm; dry film: 4-7μm; Silk screen: 250-300 mesh polyester or stainless steel screen printing; Scraper: Polyurethane or solvent resistant material; Equipment: Semi-automatic printing machine; Curing conditions: Oven: 130 ℃ × 20 min IR furnace: 135 ℃ × 10 min (can be adjusted according to customer requirements) Cleaning agent: acetone or diethylene glycol ether acetate. Due to the significant environmental impact of the process, screen printing is recommended to be divided into batches and used up within 8 hours. Installing a protective cover can reduce the volatilization of product components and cut off dust particles in the air to ensure quality.
Substrate	applicable substrate PET, PC, ITO, etc.

Mxene Modified Conductive Flexible Printed Circuit