The metal magnetron sputtering is a versatile and highly effective technique for depositing thin metallic films onto substrates. It involves the use of a magnetron, which is a combination of magnets and an electric field, to accelerate ions towards a target material. When an electric current is applied, the material is ejected from the target as ions, which then deposit onto the substrate. This method has garnered attention for its ability to create uniform films with excellent adhesion properties, making it indispensable in applications that require high precision and quality.
Applications
The system is primarily used for the deposition of a wide range of metals including Ti, Al, Cr, Pt, TiW, Mo, W, Ta, Ni, Au, and Ag, as well as Cu and ITO (indium tin oxide) sputtering for various electronic and optical applications.
Technical Specifications
- Sample Size: Ranging from 2 inches to 8 inches in diameter, as well as fragments.
- Temperature: Generally performed under ambient temperature.
- Vacuum Level: The system can achieve an ultra-high vacuum of 5 × E-7 Tor.
- Process Gas: The system is equipped with argon (Ar) and oxygen (O2) gas supplies.
- Process Rate: The system offers a typical process rate of approximately 0.5-5 Å/s.
- Film Uniformity: The uniformity of the deposited films is specified as ≤ ±5% for 500 nm thickness.
- Bias Cleaning Function: The system offers a bias cleaning function (back sputtering) for samples.
Our metal magnetron sputtering system technology platform is engineered to deliver exceptional thin film deposition solutions for a variety of industries, including semiconductor, optics, aerospace, and advanced coatings. Designed for precision and versatility, this state-of-the-art system ensures uniform and high-quality films with customizable sputtering rates, making it ideal for both R&D and large-scale production. Choose our metal magnetron sputtering system for unparalleled control and precision in thin film technology.
Please kindly note that our products are for research use only.
