Dielectric magnetron sputtering is a form of reactive sputtering that combines the benefits of magnetron sputtering with the deposition of dielectric materials. The system utilizes a magnetron to generate a plasma discharge, in which target atoms are ejected from a solid material by bombardment with energetic ions. These atoms then deposit onto a substrate, forming a thin film with exceptional uniformity, density, and adherence properties.
Applications
The dielectric magnetron sputtering system is used for the deposition of various oxide and nitride films, including Nb2O5, TiO2, SiO2, SiNx, and TiN.
It is also employed for fabricating optical coatings such as high-reflective films and antireflection coatings based on Nb2O5/SiO2 multilayer structures, widely used in optical devices and advanced coatings.
Technical Specifications
- Sample Size: Ranging from 2 inches to 8 inches in diameter, as well as fragments.
- Temperature: Heat up to 150°C.
- Vacuum Level: The system can achieve an ultra-high vacuum of 5 × E-7 Tor.
- Process Rate: The system offers a typical process rate of approximately 1.5 Å/s.
- Film Uniformity: The uniformity of the deposited films is specified as ≤ ±3%.
Our dielectric magnetron sputtering system technology platform offers cutting-edge thin-film deposition capabilities, utilizing advanced magnetron sputtering and reactive sputtering techniques. This platform is engineered for the precise deposition of various materials, including oxides and nitrides, catering to applications in optical coatings, semiconductors, and wear-resistant materials. For more services, please feel free to contact us.
Please kindly note that our products are for research use only.
